Recently added item(s)
| Graphene Sheet, Size: 1 cm x 1 cm, Thickness: 35 µm, Highly Conductive |
| Nitinol Shape Memory Alloy Sheet, Thickness: 2 mm, AF: -10 – -15°C |
| Magnesium Hydroxide (Mg(OH)2) Micron Powder, Purity: 99.95+%, Size: 325 mesh |
| Silicon Carbide (SiC) Micron Powder, Purity: 99,9%, Size: 250 µm |
| Nitinol Shape Memory Alloy Sheet, Thickness: 1 mm, AF: 50-55°C |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,5 mm, AF: 80-85°C |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,5 mm, AF: 35-40°C |
| Magnesium Carbonate (MgCO3) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Iron Oxide (Fe2O3) Micron Powder, Gamma, Purity 99.9+%, Size: 325 mesh |
| Activated Carbon (C) Nanopowder/Nanoparticles, Purity: 95%, Size: <100 nm, Charcoal |
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| Natural Graphite (C) Nanopowder/Nanoparticles, Purity: 99.9% Size: 380 nm-1.2 um |
| Iron Oxide (Fe3O4) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Nitinol Shape Memory Alloy Sheet, Thickness: 0,15 mm, AF: 15-20°C |
| Silicon Carbide (SiC) Micron Powder, Purity: 99,9%, Size: 1 µm |
| Antibacterial Nanopowder/Nanoparticles, Size: 100 nm |
| Copper Tin (Cu:85-Sn:15) Alloy Micron Powder, Purity: 99.5+%, Size: 325 mesh |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.55%, Size: 78 nm, Hydrophilic |
| Iron Oxide (Fe2O3) Micron Powder, Gamma, Purity: 99.9+%, Size: 1 µm |
| Graphene Nanoplatelet, Purity: 99.9%, Size: 3 nm, S.A: 800 m2/g, Dia: 1.5 μm |
| Coin Style Single Wafer Shipper, 3’’ / 76 mm , Natural PP |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+ %, Size: 325 mesh |
| Copper Tin (Bronze, Cu:80-Sn:20) Alloy Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Titanium Diboride (TiB2) Micron Powder, Purity: 99.5+%, Size: 40-50 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.95+%, Size: 50-100 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 10 µm, Fused |
| Coin Style Single Wafer Shipper, 2’’ / 51 mm , Natural PP |
| Copper (Cu) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Spherical |
| Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP |
| Samarium Oxide (Sm2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Titanium Diboride (TiB2) Micron Powder, Purity: 99.5+%, Size: 200 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 3 nm, S.A: 320 m2/g, Dia: 1.5 μm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 325 mesh |
| Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP |
| Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 7 μm |
| Tellurium Dioxide (TeO2) Micron Powder, Purity: 99.95 %, Size: 1-5 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 3 nm, S.A: 530 m2/g, Dia: 1.5 μm |
| Tellurium (Te) Micron Powder, Purity: 99.95 %, Size: 325 mesh |
| Boron Carbide (B4C) Micron Powder, Purity: 99.95%, Size: < 10 µm |
| Iron Oxide (Fe3O4) Micron Powder, Purity: 99.5+%, Size: 1 µm |
| Nickel (Ni) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Silicon Nitride (Si3N4) Micron Powder, Beta, Purity: 99.9%, Size: 10 µm |
| Nickel (Ni) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Porous Carbon (C) Nanopowder/Nanoparticles, Size: 18-38 nm, (Plant) |
| Graphene Sheet, Size: 5cm x 5cm, Thickness: 35 µm, Highly Conductive |
| Nanocalcite, Purity: 99.9%, Size: <200 nm |
| Silicon Nitride (Si3N4) Micron Powder, Beta, Purity: 99.9%, Size: 325 mesh |
| Strontium Titanate (SrTiO3) Micron Powder, Purity: 99.9+%, Size: 3 µm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 250 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 30 μm |
| Conductive Carbon Black Nanopowder/Nanoparticles, Purity: 95%, Size: 148 nm (Plant) |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 7 μm |
| AZ91 Magnesium Alloy Powder, Purity: 99.95%, Size: 15-53 μm |
| Graphite Micron Powder, Purity: 99.9%, Size: 5-10 µm |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 135 m2/g, Dia: 18 μm |
| Water-_19_.webp |
| Lanthanum Oxide (La2O3) Micron Powder, Purity: 99.99%, Size: 1-10 μm |
| Titanium Carbide (TiC) Micron Powder, Purity: 99,9+%, Size: 325 mesh |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 18 μm |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 28 nm, Partially Passivated |
| Hydroxyapatite Powder, Purity: 99.5+%, Size: 40-50 µm |
| Hydroxyapatite Powder, Purity: 99.5+%, Size: 10-20 µm |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 38 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, Purity: 99.5+%, Size: 78 nm, Hydrophilic |
| Graphene Nanoplatelet, Purity: 99.9+%, Size: 5 nm, S.A: 170 m2/g, Dia: 30 μm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.5+%, Size: 18 nm, Hydrophilic |
| Manganese (Mn) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis |
| Indium Hydroxide (In(OH)3) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Sulphur (S) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 3 µm |
| Tungsten Carbide (WC) Micron Powder, Purity: 99,9%, Size: -325 mesh |
| Molybdenum (Mo) Micron Powder, Purity: 99.95%, Size: 1-10 µm, Metal Basis |
| Barium Ferrite (BaFe12O19) Micron Powder, Purity: 99.9+%, Size: 1-3 µm |
| Titanium Carbide (TiC) Micron Powder, Purity: 99.99%, Size: 1 µm |
| Nickel (Ni) Micron Powder, Purity: 99.95 %, Size: 500 Mesh, Spherical |
| Titanium Hydride (TiH2) Micron Powder, Purity: 99.5%, Size: 325 mesh |
| Activated Carbon (C) Nanopowder/Nanoparticles, Size: < 90 nm, Coconut |
| Graphene Sheet, Size: 10 cm x 10 cm, Thickness: 35 µm, Highly Conductive |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: Sub-Micron, Fused |
| Silicon Dioxide(SiO2) Micron Powder, Size: -325 mesh,Purity: 99.9% |
| PTFE Nanopowder/Nanoparticles [Polytetrafluoroethylene, (C2F4)n)], Purity: 99.9% |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Conductive Bakelite Powder |
| Hydroxyapatite Micron Powder, Purity: 99.5+%, Size: 3 µm |
| Strontium Iron Oxide (SrFe12O19) Micron Powder, Purity: 99.9+%, Size: 1-3 µm |
| Barium (Ba) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 55 µm |
| Copper Oxide (CuO) Micron Powder, Purity: 99.5%, Size: 20 µm |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 20-35 µm |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.99 %, Size: -200 mesh |
| Neodymium (Nd) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 1-2 µm |
| Boron Carbide (B4C) Micron Powder, Purity: 95+%, Size: 1-3 µm |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.95+ %, Size: < 5 µm |
| Molybdenum Disilicide (MoSi2) Micron Powder, Purity: 99.5+%, Size: 1-10 µm |
| Silicon Dioxide (SiO2) Micron Powder, Size: <15 Micron, Purity: 99.8% |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 30 µm |
| Niobium (Nb) Micron Powder, Purity: 99.95%, Size: 45 µm, Metal Basis |
| Sodium Dodecyl Sulfate Micron Powder, Size: -325 mesh |
| Chromium(III) oxide (Cr2O3) Micron Powder, Purity: 99%, Average Particle Size: 4.5µm |
| Carbon Nanotubes Doped with 12 wt% Graphene Nanopowder/Nanoparticles |
| Lithium Metaborate (LiBO2) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 500 nm, Metals Basis |
| Niobium (Nb) Micron Powder, Purity: 99.95 %, Size: 10 µm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Alpha, Size: 28 nm, 22 wt% |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 90 nm, Cubic |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 280 nm, Tetragonal |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 370 nm, Tetragonal |
| Molybdenum Disulfide (MoS2) Micron Powder, Purity: 99.9+%, Size: 325 mesh |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 500 nm, Tetragonal |
| Silicon (Si) Micron Powder, Purity: 99.95%, Size: 1-3 um, Polycrystalline |
| Aluminum (Al) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.95 %, Size: 70 µm |
| Nickel Iron Oxide (NiFe2O4) Nanopowder/Nanoparticles, Purity: 98.99%, Size: 25 nm |
| Bismuth (Bi) Micron Powder, Purity: 99.9 %, Size: 200 mesh |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 55 nm |
| Iron Oxide (Fe3O4) Nanopowder/Nanoparticles, Purity: 98.45+%, Size: 18-28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.55%, Size: 18-38 nm |
| Antimony (III) Oxide (Sb2O3) Micron Powder, Purity: 99.9%, Size: 3 µm |
| Graphite (C) Micron Powder, Purity: 99.9%, Size: 1-5 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 600-850 μm |
| Phosphorus (P) Micron Powder, Purity: 99.95%, Size: 1 µm, Metal Basis |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 300-425 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 250-355 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 212-300 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 180-250 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 850-1180 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 150-212 μm |
| Lithium Hydroxide, Monohydrate (Battery Grade, LiOH.H2O), Purity: ≥ 99.0% |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 125-180 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 90-125 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 63-106 μm |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 53-90 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1180-1700 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1400-2000 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 45-75 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 34-82 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 28-70 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 22-59 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 16-49 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 12-40 μm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 8-32 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 5-25 μm |
| Activated Carbon Micron Powder, Size: 8-30 Mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 3-19 μm |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 200 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 2-14 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 355-500 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 425-600 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 500-710 μm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 3 µm |
| Nickel Chromium (Ni-Cr) Alloy Micron Powder, Size: 325 mesh, Ni-80%, Cr-20% |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 1 µm |
| Zinc (Zn) Nanopowder/Nanoparticles, Purity: 99.95%,Size: 790 nm |
| Gadolinium Oxide (Gd2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Zinc Iron Oxide (ZnFe2O4) Nanopowder/Nanoparticles, Purity: 98.7%, Size: 8-28 nm |
| Aluminum (Al) Micron Powder, Purity: 99.95 %, Size: 80 µm |
| Iron (Fe) Micron Powder, Purity: 99.5+ %, Size: 325 mesh |
| Aluminum (Al) Micron Powder, Purity: 99.95+ %, Size: 14 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 106-150 μm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1000-1400 μm |
| Nickel Oxide (NiO) Micron Powder, Purity: 99.9 %, Size: 200 mesh, Black |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Holmium (Ho) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, S-type, Spherical, Purity: 99.95+%, Size: 13-22 nm, Nonporous and Amorphous |
| Aluminum Oxide (Al2O3) Micron Powder, Alpha, Purity: 99.9%, Size: 20 µm |
| Aluminum (Al) Micron Powder, Purity: 99.9+%, Size: 9-11 µm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 10 µm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, P-type, Purity: 99.65+%, Size: 13-23 nm, Porous and Amorphous |
| Calcium Copper Titanate (CaCu3Ti4O12) Micron Powder, D50:1-3um, Purity: ≥ 99.5 % |
| Samarium Oxide (Sm2O3) Nanopowder/Nanoparticles, Purity: 99.955%, Size: 13-47 nm |
| Praseodymium Oxide (Pr6O11) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 8-110 nm |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Micron Powder, Purity: 99.9+%, Size: 20 µm |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 15 µm |
| Zinc Oxide (ZnO) Micron Powder, Purity: 99.5%, Size: 325 mesh, White |
| Molybdenum Trioxide (MoO3) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 20 nm, metal basis |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 20-40 nm |
| Carbon Nanofibers, Purity: > 95%, Outside Diameter: 50-150 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Aluminum (Al) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Spherical |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Zirconium (Zr) Micron Powder, Purity: 99.5%, Size: 80 µm, Metal Basis |
| Activated Carbon Micron Powder, Size: 4000 µm |
| Vulcan XC72 Conductive Carbon Black |
| Lanthanum Oxide (La2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 8-190 nm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 10 µm |
| Boron Nitride (BN) Micron Powder, Purity: 99.7%, Size: 40-50 µm, Hexagonal |
| Activated Carbon Micron Powder, Size: 2000 µm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 780 nm, Metal Basis |
| Zinc Ferrite (ZnFe2O4) Micron Powder, Zinc Iron Oxide Micron Powder, -200 mesh, 99.9% |
| Activated Carbon Micron Powder, Size: 1500 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 28-48 nm, Metal Basis |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+%, Size: 20 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 28-48 nm, w/~0.25% PVP |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 290 nm, Hydrophilic |
| Polyether Ether Ketone (PEEK) Micron Powder, Purity: 99.95+ %, Size: <325 mesh |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 48-78 nm, metal basis |
| Barium Carbonate (BaCO3) Nanopowder/Nanoparticles, Purity: 99.98%, Size: 780 nm |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 7 µm |
| Cadmium (Cd) Micron Powder, Purity: 99.99 %, Size: 200 mesh, Irregular |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 790 nm |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 10 µm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, w/~0.25% PVP |
| Tungsten Disulfide Micron powder, WS2, 99.9%, 325 mesh |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, High Purity: 99.87%, Size: 30-60 nm |
| Aluminum (Al) Micron Powder, Purity: 99.9+ %, Size: 5 µm |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: < 77 nm |
| Magnesium Hydroxide (Mg(OH)2) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8 nm |
| Silver (Ag) Micron Powder, Purity: 99.99 %, Size: Sub-Micron |
| Lithium Titanium Oxide (Li4Ti5O12) Micron Powder for Li-ion Battery Anode (LTO) |
| Bismuth Oxide (Bi2O3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 75-195 nm |
| Aluminum Hydroxide (Al(OH)3) Nanopowder/Nanoparticles, High Purity: 99.95%, Size: 8-18 nm, Hydrophilic |
| Silver-_Ag_-Micron-Powder-99.9_-1-3-um.webp |
| Silver (Ag) Micron Powder, Purity: 99.9 %, Size: 1-3 µm |
| Porous Carbon (C) Nanopowder/Nanoparticles, Purity: 95%, Size: 55-75 nm, (Plant) |
| Praseodymium Oxide (Pr6O11) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 13-57 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Amorphous, Purity: 98.5+%, Size: 55-75 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Amorphous, Purity: 99.5+%, Size: 15-35 nm |
| Tungsten Oxide (WO3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 55 nm, Tetragonal |
| Selenium (Se) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| Zirconium Hydride (ZrH2) Micron Powder, Purity: 99.5+%, Thickness: 1- 10 µm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 136 nm, Hydrophilic |
| Titanium (Ti) Micron Powder, Purity: 99.5+%, Size: 325 mesh |
| Antimony (Sb) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 90nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Manganese Iron Oxide (MnFe2O4) Nanopowder/Nanoparticles, Purity: 98.95%, Size: 55 nm |
| Nickel (Ni) Micron Powder, Purity: 99.5+%, Size: 325 mesh, Spherical |
| Boron (B) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 450 nm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 34-82 μm |
| Graphite (C) Micron Powder, Purity: ≥99.99%, Size: < 45 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 1400-2000 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+% , Size: 1180-1700 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 1000-1400 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 850-1180 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 600-850 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 500-710 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 425-600 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 355-500 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 300-425 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 250-355 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 212-300 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 180-250 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 150-212 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 125-180 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 106-150 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 90-125 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 63-106 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 53-90 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 45-75 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 28-70 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 22-59 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99+%, Size: 16-49 µm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 12-40 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 8-32 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 5-25 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 3-19 μm |
| Silicon Carbide (SiC) Micron Powder, Purity: 99.5+%, Size: 2-14 μm |
| Manganese Ferrite Black Oxide Micron Powder, (Fe,Mn)3O4, 94+%, -325 mesh |
| Nickel Oxide (NiO) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Green |
| Yttrium Oxide (Y2O3) Nanopowder/Nanoparticles, Purity: 99.999%, Size: 25-50 nm |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-18 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Purity: 95.9+%, Size: 18-35 nm, KH570 Coated |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 90 nm |
| Antimony-Oxide-400-nm-99-.webp |
| Antimony Oxide (Sb2O3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 400 nm |
| Zirconium (II) Hydride (ZrH2) Micron Powder, Purity: 99.9+%, Size: <10 µm |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles Water Dispersion, Size: 25-45 nm, 22 wt% |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 10-40 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Amorphous, Size: 45 nm, Al2O3: 92 wt%, H2O: 6-7 wt% |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 18 nm |
| Hafnium Oxide (HfO2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 55-75 nm |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 35 nm |
| Tungsten Carbide (WC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 55 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles, Purity: 96.3+%, Size: 18-35 nm, KH550 Coated |
| Barium Titanate (BaTiO3) Micron Powder, Purity: > 99 %, Size: 1-3 µm |
| Hafnium Oxide (HfO2) Micron Powder, Purity: 99.9+%, Size: 1 µm |
| Silver (Ag) Doped Antibacterial Nanopowder/Nanoparticles, Size: 100 nm |
| Hydroxyapatite Nanopowder/Nanoparticles, Needle Type, Purity: 96%, Size: 200 nm |
| Zinc Ferrite (ZnFe2O4) Micron Powder, Zinc Iron Oxide Micron Powder, -325 mesh, 99.9% |
| Iron (Fe) Micron Powder, Purity: 99%, Size: 100 mesh |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: %99.99, Size: 20-30 nm, 167 ppm |
| Activated Carbon & Carbon Nanotube Mixed |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 20 µm |
| Titanium Silicon Carbide (Ti3SiC2) Micron Powder, Purity: 99.5+%, Size: < 325 mesh |
| Aligned Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm, Length 9-14 µm |
| C-NERGY Super P Conductive Carbon Black, 1 bag: 40 g |
| Titanium Diboride (TiB2) Micron Powder, Purity: 98.5+%, Size: 2.5-13 μm |
| Zinc Oxide (ZnO) Nanopowder Dispersion in Ethanol, Size: 20-30nm, 20wt% |
| Magnesium Oxide (MgO) Micron Powder, Purity: 99.99 %, Size: 500 nm – 1500nm |
| Silver (Ag) Nanopowder/Nanoparticles, Purity: 99.95% , Size: 45-75 nm, w/~0.25% PVP |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: 790 nm |
| Silica (SiO2) Micron Powder, Spherical, APS: 0.3um, SiO2 Content:99.5+% |
| Terbium Oxide (Tb4O7) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Lithium Fluoride Powder, Size: <100 μm, Purity: 99.95 % |
| Yttrium (Y) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Cerium Oxide (CeO2) Micron Powder, Purity: 99.99%, Size: 325 mesh, White |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.95%, Size: 180 nm, Hydrophilic |
| C-NERGY SUPER C45 Conductive Carbon Black (set: 80 g) |
| KETJENBLACK EC-300J Conductive Carbon Black |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Holmium Oxide (Ho2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Alpha/Gamma, Size: 48 nm, 85% Alpha, 15% Gamma |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Tungsten Disulfide (WS2) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Lanthanum (La) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Titanium Aluminum Carbide (Ti2AlC) Micron Powder, Purity: 99.9+%, Size: 50 µm |
| Aluminum Nitride (AlN) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 60-70 nm, Hexagonal |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, Partially Passivated |
| Hydroxyapatite Nanopowder/Nanoparticles, Purity: 95% min, Size: 50 nm |
| Antimony Tin Oxide (ATO) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 20-50 nm |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 780 nm, metal basis |
| Chromium (Cr) Micron Powder, Purity: 99.9 %, Size: 15-60 µm, Spherical |
| Tungsten Carbide Cobalt (WC/Co) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 35-75 nm |
| Nanoclay, Purity: 99.9%, Size: 800 nm |
| Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.7%, Size: 790 nm, Hexagonal |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1-10 μm |
| Barium Titanate (BaTiO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 45 nm, Cubic |
| Gadolinium Oxide (Gd2O3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 13-95 nm |
| Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion, Size: 40-50 nm, 22 wt% |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Neodymium Oxide (Nd2O3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 25-40 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.995%, Size: 4 nm, Hydrophilic |
| P25 Titanium Dioxide Nanopowder (TiO2) Purity 99.5+ % Size 20 nm |
| Lanthanum Oxide (La2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: < 180 nm |
| Erbium Oxide (Er2O3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 8-90 nm, Cubic |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 50-150 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 50-150 µm |
| Manganese Dioxide (MnO2) Micron Powder, Purity: 99 %, Size: 200 mesh |
| Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 30 nm |
| Titanium Nitride (TiN) Nanopowder/Nanoparticles, Purity: 99.2+%, Size: 20 nm, Cubic |
| Titanium Carbide (TiC) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 35-55 nm, Cubic |
| Tantalum Carbide (TaC) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 950 nm, Cubic |
| Molybdenum Oxide (MoO3) Nanopowder/Nanoparticles, High Purity: 99.96+%, Size: 8-75 nm |
| CR2025 Coin Cell Cases (Positive and Negative Cases), Materials: 304SS |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-28 nm |
| Chromium Oxide (Cr2O3) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 55 nm, Hexagonal |
| Nickel (II) Hydroxide (Ni(OH)2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm, Beta |
| Selenium Dioxide (SeO2) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 0.5 wt% |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles Water Dispersion, Size: 25-35 nm, 22 wt% |
| Boron Carbide (B4C) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 40-60 nm, Hexagonal |
| Titanium (Ti) Micron Powder, Purity: 99.5+%, Size: 200 mesh |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5%, Size: 20 nm, Laser Synthesized |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 22 nm, Partially Passivated |
| Yttrium Oxide (Y2O3) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18-38 nm |
| Nitinol Shape Memory Alloy Wire, Diameter: 2 mm, AF: 80-85°C |
| KETJENBLACK EC-600JD Conductive Carbon Black |
| Strontium Titanate (SrTiO3) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 300-500 nm |
| Iron Oxide (Fe3O4) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 14-29 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile:99.5+%, Size: 200 nm |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.75%, Size: 48 nm |
| Dysprosium Oxide (Dy2O3) Nanopowder/Nanoparticles, High Purity: 99.95+%, Size: 28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Alpha, High Purity: 99.6+%, Size: 28 nm |
| Iron Oxide (Fe2O3) Nanopowder/Nanoparticles, Gamma, High Purity: 99.55+%, Size: 18 nm |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Polymer Dispersant for Dispersion of Carbon Nanotubes (CNTs) in Ester Solvents |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, Purity: 99.97%, Size: 430 nm |
| 304 Stainless Steel Wave Spring (Belleville Washers) for CR2032, Diameter: 15.4 mm, Thickness: 0.2 mm, Height: (1.2±0.03) mm |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.77%, Size: 48 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 10-30 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 0.5 mg/mL |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 30-60 µm |
| Calcium Copper Titanate (CaCu3Ti4O12) Nano Powder, D50: 360 nm, Purity: ≥ 99.5 % |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 45-75 nm, Length: 8-18 µm |
| Multi Walled Carbon Nanotubes, Purity: > 95%, Outside Diameter: 30-50 nm |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 18 nm, KH550 |
| Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Lithium Carbonate (Battery Grade, Li2CO3) Purity ≥99.5% |
| Activated Carbon Micron Powder, Size: 200 Mesh |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 30-60 µm |
| Iron Nickel (Fe-Ni) Alloy Powder, Purity: 99.9%, Size: 325 mesh, Fe/Ni: 5:5 |
| Tin (Sn) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 0.5 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 12 nm, Anatase, 22 wt % |
| Tungsten (W) Micron Powder, Purity: 99.95 %, Size: 2 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 10-25 µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 15-45 µm |
| Tungsten Oxide (WO3) Micron Powder, Purity: 99.99%, Size: 3 µm |
| Lithium Manganese Oxide (LiMn2O4) Powder for Li-ion Battery Cathode Application |
| Europium Oxide (Eu2O3) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 8-90 nm, Cubic |
| Lead (Pb) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Gadolinium Oxide (Gd2O3) Micron Powder, Purity: 99.99%, Size: 2-3 μm |
| Calcium Oxide (CaO) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 10-70 nm |
| Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 15-20°C |
| Copper Oxide (CuO) Nanopowder/Nanoparticles, High Purity: 99.995%, Size: 15-45 nm |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Tantalum Carbide (TaC) Micron Powder, Purity: 99.9 %, Size: 3 µm |
| Type 316 Stainless Steel Powder, Purity: 99.9 %, Size: 325 mesh |
| Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 45-50°C |
| Titanium Dioxide (TiO2) Micron Powder, Purity: 99.5+ %, Size: 1 µm, White, Rutile |
| Calcium Oxide (CaO) Micron Powder, Purity: 99.9 %, Size: 1µm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 718 Powder, Size: 15-45 µm |
| Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.85+%, Size: 65-75 nm, Hexagonal |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 45-65 nm, Oxygen Content: < 3% |
| Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, High Purity: 99.55%, Size: 28-48 nm |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| Multi Walled Carbon Nanotubes, Purity: 92%, Outside Diameter: 8-10 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 7-16 nm |
| Aqueous Suspension of Nanocrystalline Cellulose (NCC), 6%wt |
| Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 20 µm |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| Manganese Oxide (Mn2O3) Nanopowder/Nanoparticles, Purity: 99.4%, Size: 28 nm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 99+%, Size : < 70 nm, Laser Synthesized |
| Aluminum Sulfate Octadecahydrate (Al2H36O30S3), Purity: > 99% |
| Cadmium Selenide (CdSe) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: <100 nm |
| Graphite (C) Nanopowder/Nanoparticles, Purity: 99.9 %, Size: < 50 nm |
| Boron (B) Nanopowder/Nanoparticles , APS:100 nm, Purity:99.55+% |
| Niobium Carbide (NbC) Micron Powder, Purity: 99.95%, Size: 1-3 µm |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 35-55 nm, Oxygen Content: < 3% |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Coated with Aluminic Ester, Alpha, Size: 55 nm, Super Hydrophobic, Al2O3: Aluminic Ester=98.1:1.2 |
| Double Walled Carbon Nanotubes, Purity: > 65% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile Si Oil, Size: 25 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 28 nm |
| Titanium Carbide (TiC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 45 nm |
| Zirconium Carbide (ZrC) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 400-1100 nm, Cubic |
| Silicon Carbide (SiC) Micron Powder, Beta, Purity: 99.5+%, Size: < 2,6 µm, Whisker |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 18 nm |
| Nickel Tabs, Width: 3 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile Al, Si, Stearic Acid, Size: 25 nm |
| Indium Tin Oxide (ITO) Nanopowder/Nanoparticles, 90:10, Purity: 99.99%, Size: 18-65 nm |
| High Capacity and High Purity Graphite Micron Powder for Li-ion Battery |
| Antimony (Sb) Micron Powder, Purity: 99.99 %, Size: 200 mesh |
| Manganese Sulfate Monohydrate (MnSO4.H2O), Purity: > 99% |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: Sub-Micron |
| Magnesium (Mg) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis |
| Expandable Graphite, Purity: 95-97%, Size: 50 mesh |
| Tungsten (W) Micron Powder, Purity: 99.95 %, Size: 5 µm |
| Titanium (Ti) Micron Powder, Purity: 99.5+ %, Size: 100 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 200 mesh, Fused |
| Europium (Eu) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Zinc Oxide (ZnO) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30-50 nm |
| Lithium hydroxide monohydrate (Trace Metals basis, LiOH.H2O), Purity: 99.995% |
| Molybdenum (Mo) Micron Powder, Purity: 99.99 %, Size: 10 µm |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 325 mesh |
| Aligned Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm, Length 25-95 µm |
| Bismuth Oxide (Bi2O3) Micron Powder, Purity: 99.99%, Size: 1-5 µm |
| Carbon Nanotubes Doped with 32 wt% Graphene Nanopowder/Nanoparticles |
| Carbon Black Powder, Purity: 99.99 %, Size: 4 µm |
| Bismuth Oxide (Bi2O3) Micron Powder, Purity: 99.99%, Size: 10 µm |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99.5+%, Size: 1-2 µm, Fused |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Purity: 99.5+ %, Size: 20-30 nm |
| Graphene Oxide Dispersion, 8 mg/mL, in H2O |
| Nitinol Shape Memory Alloy Wire, Diameter: 0,5 mm, AF: -10 – -15°C |
| Cobalt Iron Oxide (CoFe2O4) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30 nm |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm |
| 304SS Coin Cell Conical Spring for CR2032, Diameter: 15.4 mm, Height: 1.1 mm, Thickness: 0.25 mm |
| Manganese (II) Carbonate (MnCO3) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: 50 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| (-COOH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: 10 µm |
| Conductive Graphite Powder for Lithium Battery, Purity: 99.9+%, Size: 1-5 µm |
| Cellulose Nanocrystal (Nanocrystalline Cellulose,CNC) |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| CNTs-High Impact Polystyrene Resin Matrix, CNTs: 22 wt%, HIPS: 78 wt% |
| Expandable Graphite, Purity: 99-99.5%, Size: 50 mesh |
| Aluminum Oxide (Al2O3) Micron Powder, Purity: 99+%, Size: 325 mesh, Fused |
| Carbon Black & Carbon Nanotube Mixed, Purity: >97.5% |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Carbon Nanotubes-based Conductive Additives for Lithium Ion Battery |
| Indium Tin Oxide (ITO) Nanopowder/Nanoparticles, 95:5, Purity: 99.97+%, Size: 18-73 nm |
| Magnesium Carbonate (MgCO3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 10-70 nm |
| Chromium Carbide (Cr3C2) Nanopowder/Nanoparticles, Purity: 99.75+%, Size: 25-125 nm |
| Zinc Cobalt Iron Oxide (Zn0.5Co0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 38 nm |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Water, Amorphous, Size: 28 nm, 26 wt% |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 22 nm, Amorphous, 15 wt% |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 22 nm, Amorphous, 15 wt% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.9%, Size: 1 µm |
| Boron (B) Micron Powder, Purity: 99 %, Size: 10 µm, Amorphous |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 1 mg/mL |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 570 nm, Metal Basis |
| Copper (Cu) Nanowire, Purity: 99.55%, in Ethanol |
| Tungsten Disulfide (WS2) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 35-75 nm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Partially Passivated |
| Zirconium Carbide (ZrC) Nanopowder/Nanoparticles, Purity: 99.5+%, Thickness: 18 nm, Cubic |
| Magnesium Carbonate (MgCO3) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 8 nm |
| Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell, Width: 4 mm |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: %99.99, Size: 3 nm, 2200 ppm |
| Zirconium Hydride (ZrH4) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: 20-40 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.250” |
| C-NERGY SUPER C65 Conductive Carbon Black |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Metal Basis |
| Carbon Titanium Nitride (TiNC) Micron Powder, Purity: 99.95%, Size: 1.05-3.05 μm |
| Zirconia-Yttria Nanopowder/Nanoparticles, ZrO2-8Y, Purity: 99.95%, Size: 30 nm |
| Triton X-100 |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 22 nm, Carbon Coated |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size:18 nm, Carbon Coated |
| Silicon Carbide (SiC) Micron Powder, Purity: 98+%, Size: 1-10 μm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1350 W/m.K, Thickness: 40 µm, Lenght: 115 mm, Width: 90 mm |
| PTFE Inside Chamber for Hydrothermal Synthesis Autoclave Reactors, Volume:50,100,500 ml |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Gamma, Size: 8 nm, 22 wt% |
| 304SS Coin Cell Battery Spacer, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Polytetrafluoroethylene (PTFE) Condensed Liquid Binder for Li-ion Battery |
| Molybdenum (Mo) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 490 nm |
| Molybdenum Carbide (Mo2C) Micron Powder, Purity: 99.95%, Size: 2.6 µm, Hexagonal |
| Zinc Carbonate (ZnCO3) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm |
| Molybdenum (Mo) Micron Powder, Purity: 99.99 %, Size: 1 µm |
| 316 Stainless Steel Wave Spring (Belleville Washers) for CR2032, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase/Rutile, Purity: 99.5+%, Size: 18 nm |
| Cobalt Aluminate Blue Spinel Nanopowder CoAl2O4 Size: 300-500 nm |
| Nickel Foam for Battery Applications Size: 200 mm x 300 mm x 0.5 mm |
| Indium Hydroxide (In(OH)3) Nanopowder/Nanoparticles, High Purity: 99.996%, Size: 15-65 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Purity: 99.5+ %, Size: 17 nm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1700 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 12 nm, Anatase, 22 wt% |
| Stellite 6 Spherical Micron Powder, Size : 15-45μm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1600 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 48-78 nm |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles Water Dispersion, Size: 25-45 nm, 42 wt% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile, High Purity: 99.5+ %, Size: 45 nm |
| Silicon Carbide (SiC) Micron Powder, Beta, Purity: 99.5+%, Size: 1.5-35 µm, D50 |
| Erbium (Er) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Cerium Oxide (CeO2) Nanopowder/Nanoparticles, Purity: 99.975%, Size: 8-28 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| (-OH) Functionalized Single Walled Carbon Nanotubes, Purity: > 65% |
| Nickel Hydroxide Ni(OH)2 (NiOH-Co) Micron Powder, Size: 10-15 µm, Spherical |
| Magnesium Oxide (MgO) Nanopowder/Nanoparticles Ethanol Dispersion, Size: 45 nm, 22 wt% |
| Nitinol Shape Memory Alloy Wire, Diameter: 1,5 mm, AF: 35-40°C |
| Terbium (Tb) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 18-28 nm |
| Carbon Nanotubes Doped with 52 wt% Boron Nitride (BN) Nanopowder/Nanoparticles |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 4-16 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Lithium Nickel Manganese Cobalt Oxide (LiNiCoMnO2) Powder for High Power Li-ion Battery Cathode Application, (Ni:Mn:Co=5:3:2) NMC 532 |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80-240 nm, Metal Basis |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder, 10-20 micron, F/C Ratio : 1.0 |
| Silicon Nitride (Si3N4) Nanopowder/Nanoparticles, Beta, Purity: 99.6%, Size: 760 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| (-COOH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Nickel Cobalt Iron Oxide (Ni0.5Co0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 35 nm |
| Tin (Sn) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 50-70 nm, Metal Basis |
| Zinc (Zn) Nanopowder/Nanoparticles, High purity: 99.995+%, Size: 90-110 nm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 50-150 µm, Spherical |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 115 mm, Width: 90 mm |
| Spherical Nickel Base Alloy Micron Powder, Inconel 625 Powder, Size: 10-25 µm |
| Carbon Nanotubes Doped with 52 wt% Graphene Nanopowder/Nanoparticles |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Zinc Manganese Iron Oxide (Zn0.5Mn0.5Fe2O4) Nanopowder/Nanoparticles, Purity: 99.995%, Size:28-58 nm |
| Carboxymethyl Cellulose (CMC) Micron Powder for Li-ion Battery Anode Materials |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 48-78 nm |
| Carbon Nanotubes Thermal Radiation Coating Dispersion |
| (-OH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm |
| High Temperature Polyimide Tape for Lithium Battery, Width: 10 mm |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-15 nm |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 48-78 nm |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 48-78 nm |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 18-38 nm |
| Reduced Graphene Oxide (rGO),Purity: 99%, S.A: 15.62 m2/g, 2-5 layers |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 0.5 wt% |
| Tungsten Oxide (WO3) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 20-60 nm, Orthorhombic |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis |
| Titanium Nitride (TiN) Nanopowder/Nanoparticles, Purity: 99.3+%, Size: 790 nm, Cubic |
| (-COOH) Functionalized Single Walled Carbon Nanotubes, Purity: > 65% |
| Silicon Monoxide (SiO) Pellets, Purity: 99.99%, Size: 1-3 mm |
| Erbium Oxide (Er2O3) Micron Powder, Purity: 99.99%, Size: 1-10 µm |
| Zinc Titanate Micron Powder (ZnTiO3) Purity: 99+%, Size: 1-2 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, High Purity: 99.5+ %, Size: 10-20 nm |
| Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| Aluminum (Al) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| (-OH) Functionalized Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Zirconium Diboride (ZrB2) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 45 nm, Hexagonal |
| Praseodymium Oxide (Pr6O11) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Carbon Aluminum Nitride (AlNC) Micron Powder, Purity: 99.95%, Size: 1-3 µm |
| (-OH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Water, Gamma, Size: 28 nm, 22 wt% |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Nanopowder/Nanoparticles Dispersion in Water, Amorphous, Size: 8-33 nm, 26 wt% |
| Zinc (Zn) Nanopowder/Nanoparticles, High purity: 99.9+%, Size: 60-70 nm |
| CR2025 Coin Cell Cases (Positive and Negative Cases), Materials: 316SS |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 25-50 µm, Spherical |
| Iron (II,III) Oxide (Fe3O4) Nanopowder/Nanoparticles Water Dispersion, Size: 13-18 nm, 22 wt% |
| Lithium Zirconate (Lithium Zirconium Oxide, Li2ZrO3), Purity: ≥99, Size: 1 -3 µm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 25-45 nm, 42 wt% |
| 316SS Coin Cell Battery Spacer, Diameter: 15.8 mm, Thickness: 0.5 mm |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder for Li-ion Battery, 10-20 micron, F/C Ratio : 0.8-1.0 |
| Thulium Oxide (Tm2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in 1, 2-Propanediol, Size: 12 nm, Gamma, 18 wt% |
| Lithium Iron Phosphate (LiFePO4) Powder for Li-ion Battery Cathode Application |
| Indium Oxide (In2O3) Nanopowder/Nanoparticles, High Purity: 99.9%, Size: 18-68 nm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 325 mesh |
| (-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 90%, Outside Diameter: 50-80 nm |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in Ethylene Glycol, Size: 12 nm, Gamma, 18 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 3-28 nm, 16 wt% |
| Silicon (Si) Micron Powder, Purity: 99.99 %, Size: 1 µm |
| Short Single Walled Carbon Nanotubes, Purity: > 65%, SSA: 400 m2/g |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 60-70 nm, Metal Basis |
| Lanthanum Trifluoride (LaF3) Nanopowder/Nanoparticles, Highly Dispersible, Purity: 99+%, Size: 30-50 nm |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 48-78 nm |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 90-100 nm, Metal Basis |
| Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 48-78 nm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Silicon Nitride (Si3N4) Nanopowder/Nanoparticles, Amorphous, Purity: 99.5%, Size: 20-35 nm |
| Erbium Oxide (Er2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: < 70 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 4-28 nm, 17 wt% |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 25-45 nm, 22 wt% |
| Cellulose Nanofiber (Cellulose Nanofibril, Nanofibrillated Cellulose, CNFs) |
| Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Anatase, Size: ≤10nm |
| 316SS Coin Cell Conical Spring for CR2032, Diameter: 15.4 mm, Height: 1.2 mm, Thickness: 0.25 mm |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 110 nm, Metal Basis |
| Dysprosium Oxide (Dy2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Neodymium Oxide (Nd2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Manganese (II) Acetate Tetrahydrate (C4H16MnO8), Purity: > 99% |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 28-48 nm |
| Ytterbium (Yb) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: ≥99.9%, Size: 68 nm, Metal Basis |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 14 nm, 1200 ppm |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 28-48 nm |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 1,0 wt% |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| (-COOH) Functionalized Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99 %, Outside Diameter: 48-78 nm |
| Lithium Nickel Manganese Oxide (LMNO) for Li-Ion Cathode Material, LiNi0.5Mn1.5O4 |
| Zirconium Nitride (ZrN) Micron Powder, Purity: 99.97%, Thickness: 3.5 μm, Cubic |
| Cadmium Sulfide (CdS) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 20 nm |
| Dummy CZ-Si Wafer, Size: 8”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 1000 (ohm.cm), 1-Side Polished, Thickness: 725 ± 50 μm |
| Cuprous Oxide (Cu2O) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 16 nm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Rutile, Size: 3-13 nm, 16 wt% |
| Aluminum Chloride Hexahydrate (AlCl3H12O6), Purity: > 97% |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 4-16 nm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 15-35 µm, Spherical |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Water Dispersion, Gamma, Size: 100-200 nm, 23wt% |
| Terbium Oxide (Tb4O7) Nanopowder/Nanoparticles, Purity: 99.97%, Size: 8-110 nm, Cubic |
| Conductive Acetylene Black for Li-ion Battery Anode/Cathode |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| ZK60 Magnesium Alloy Micron Powder, Size Range: 20-63 µm, Spherical |
| High Temperature Teflon Tape for Lithium Battery, Width: 19 mm, Thickness: 0.13 mm, Length: 10 m |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 1,0 wt% |
| (-OH) Functionalized Double Walled Carbon Nanotubes, Purity: > 65% |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 1 wt% |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Graphene Sheet, Size: 29 cm x 29 cm, Thickness: 35 µm, Highly Conductive |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lithium (Li) Foil Thickness:0.5 mm, Width: 50 mm, Length: 100 mm, Purity: 99.9% |
| Yttrium Aluminate (Y3Al5O12) Nanopowder/Nanoparticles, Purity: 99.7+%, Size: 25 nm |
| Silver (Ag) Nanopowder/Nanoparticles Water Dispersion, Size: 2 nm, Colorless & Transparent, 2.200 ppm |
| Water.webp |
| Water Soluble Carbon Quantum Dots 590-620 nm |
| Boron (B) Micron Powder, Purity: 95+%, Size: 1-2 μm Amorphous |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:75-150 µm, Spherical |
| G-QD.webp |
| Graphene Quantum Dots (1mg/ml) (GQD) |
| Barium Iron Oxide (BaFe12O19) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 55 nm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Hafnium Oxide (HfO2) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 18-28 nm |
| (-COOH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Titanium Alloy Micron Powders, CPTi, 50-150 µm, Spherical |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 8-18 nm |
| Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles, Size: < 80 nm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Short Length Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm |
| Zirconium Diboride (ZrB2) Micron Powder, Purity: 99.5%, Size: 5.5 μm, Hexagonal |
| Nickel (Ni) Micron Powder, Purity: 99.95 %, Size: 4 µm, Spherical |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Cadmium Sulfide (CdS) Nanopowder/Nanoparticles, Purity: 99.95+%, Size: 5 nm |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| High Purity Natural Graphite Nanopowder/Nanoparticles for Li-ion Battery, Purity: 99.99+%, Size: 30 nm |
| Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 2 mg/mL |
| Iron (Fe) Micron Powder, Purity: 99.99 %, Size: 5 µm |
| Spherical TC4 Titanium Based Micron Powder for 3d Printers, Ti6Al4V, 10-25 µm, Spherical |
| Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 1 µm, Spherical |
| Industrial Grade Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Titanium Alloy Micron Powders, CPTi, 25-50 µm, Spherical |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 25-45 nm, 16 wt% |
| Aluminum chloride (AlCl3) Purity: > 99% |
| Cuprous Oxide (Cu2O) Micron Powder, Purity: 99.99 %, Size: 3 µm |
| Vanadium Carbide (VC) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 550-750 nm, Cubic |
| Lead (Pb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 18-28 nm, Length: 8-35 µm |
| Boron (B) Micron Powder, Purity: 95+ %, Size: -325 mesh, Amorphous |
| Lithium Nickel Manganese Cobalt Oxide (LiNiMnCoC) Powder (NMC 622) |
| Lithium Nickel Manganese Cobalt Oxide Powder (NMC 811) |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Foam for Battery and Supercapacitor Research, Purity: 99+%, Size : 100 mm x100 mm x 4mm |
| Titanium Alloy Micron Powders, CPTi, 15-35 µm, Spherical |
| Lithium Nickel Manganese Cobalt Oxide (LiNiMnCoC) Powder (NMC 111) |
| Nickel (III) Oxide (Ni2O3) Nanopowder/Nanoparticles, Purity: 99.95+ %, Size: 40 nm |
| (-OH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 28-48 nm |
| Tungsten (W) Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 70 µm |
| Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 8-18 nm |
| Manganese (II) Chloride (MnCl₂), Purity: > 99% |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Helical Multi Walled Carbon Nanotubes, Outside Diameter: 75-175 nm, Length: 2-15 µm |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel-Coated Multi Walled Carbon Nanotubes, Purity: > 99%, Outside Diameter: 4-16 nm |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.955+%, Size: 65 nm, Metal Basis |
| Multi Walled Carbon Nanotubes N-Methyl-2-Pyrrolidinone Dispersion, 4 wt%, Purity: > 96 %, OD: 18-28 nm, Length 8-18 µm |
| Iron (III) Chloride (FeCl3), Purity: > 99% |
| Carbon Nanotubes Metal Tapes with Iron (Fe) 14 wt%, Thickness: 18 µm, Dia: 47 mm |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Carbon Coated |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Graphene Oxide, 2-5 Layer, Dia: 4,5 µm, SA: 420 m2/gr |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Copper Oxide (CuO) Nanopowder/Nanoparticles Water Dispersion, Size: 20-50 nm, 22 wt% |
| Zinc Sulfide (ZnS) Pellets, Purity: 99.99%, Size: 1-10 mm |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in Water, Anatase, Size: 3-12 nm, 16 wt% |
| (-OH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 7-16 nm |
| Graphitic Carbon Nitride (g-C3N4) Powder 1-10 μm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3” , Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotube-Mica Prepared by Electrostatic Adsorption, CNTs: 15 wt%; Mica: 85 wt% |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Silver Tin (Ag-Sn) Alloy Nanopowder/Nanoparticles, Purity: 99.95%, Size : < 110 nm |
| Carbon Nanotube-TiO2 Prepared by Electrostatic Adsorption, CNTs: 15 wt%, TiO2-rutile: 85 wt% |
| Copper Foam for Battery and Supercapacitor Research, Purity: 99.9+%, Size : 100 mm x100 mm x 1mm |
| Cobalt (Co) Micron Powder, Purity: 99.9%, Size: 100 mesh |
| Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 2 wt% |
| Cobalt Titanate Green Spinel Nanopowder ( Co2TiO4) |
| Titanium Oxynitride Nanoparticle, APS: 20 nm, Purity: 99.9% |
| Europium Oxide (Eu2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Lithium Nickel Cobalt Aluminum Oxide (NCA) (LiNi0.8Co0.15Al0.05O2) Powder for High Power Li-ion Battery Cathode Application |
| Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: 50-70 nm |
| Silver Copper (Ag-Cu) Alloy Nanopowder/Nanoparticles, Purity: 99.95% , Size: < 110 nm |
| Tungsten Carbide (WC) Nanopowder/Nanoparticles, Purity: 99.96%, Size: 25-95 nm |
| Iron Foam for Battery and Supercapacitor Research, Purity:98%, Size:300*200mm, Thickness: 2mm |
| PVDF Binder for Li-ion Battery Electrodes (set: 80g ) |
| Zinc (Zn) Micron Powder, Purity: 99.9%, Size: 10 µm |
| Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Lead Oxide (PbO) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Yellow |
| Multi Walled Carbon Nanotubes Water Dispersion, 4 wt%, Purity: > 96%, OD: 3-13 nm, Length: 45 µm |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 180 mm, Width: 115 mm |
| Titanium Alloy Micron Powders, CPTi, 10-25 µm, Spherical |
| Tungsten Oxide (WO3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Carbon Nanotubes Doped with 52 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Tin (Sn) Nanopowder/Nanoparticles |
| Titanium Aluminum Carbide (Ti2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:15-53 µm, Spherical |
| Super Conductive Carbon Black Nanopowder and Carbon Nanotube Mixed |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Graphitized Carbon Nanofiber, Purity: 99.95%, Size: 200-600 nm |
| Cesium Tungsten Oxide (Cs0.33WO3) Nanopowder/Nanoparticles, Purity: 99+%, Size: 18 nm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Cuprous Oxide (Cu2O) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 80 nm |
| Tantalum Pentoxide (Ta2O5) Micron Powder, Purity: 99.9 %, Size: 3 µm, White |
| Titanium (Ti) Micron Powder, Purity:99.5+%, Size:5-25 µm, Spherical |
| SS316 Coin Cell Battery Spacer, Diameter: 15.8mm, Thickness: 1mm |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 52 wt% Silica (SiO2) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Iron Oxide (Fe3O4) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Zinc (Zn) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Titanium (Ti) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Cobalt (Co) Nanopowder/Nanoparticles |
| Gold (Au) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 20-30 nm, 172 ppm |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Chromium Nitride (CrN) Micron Powder, Purity: 99.99%, Size: 1-3 µm |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Cobalt Oxide (CoO) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Graphite Sheet Thermal Interface Material, EYG Series, 1600 W/m.K, Thickness: 25 µm, Lenght: 230 mm, Width: 180 mm |
| Boron (B) Micron Powder, Purity: 95+%, Size: < 1 µm, Amorphous |
| (-COOH) Functionalized Short Single Walled Carbon Nanotubes, Purity: > 65% |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 4”, Thickness: 0.250” |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Single Walled Carbon Nanotubes, Purity: > 92%, OD: 1-2 nm |
| Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm, Cubic |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Dispersion in PGMEA or PGME, Size: 1 µm, Rutile, 20 wt% |
| Carbon Nanotubes Doped with 52 wt% Alumina (Al2O3) Nanopowder/Nanoparticles |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles, Rutile: 90 wt%, CNTs: 8 wt% |
| Lithium (Li) Foil Thickness:0.6 mm, Width: 25 mm, Length: 100 mm, Purity: 99.9% |
| Carbon Nanotubes Doped with 52 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Titanium Aluminum Carbide (Ti3AlC2) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Nitrogen-doped Multi Walled Carbon Nanotubes |
| Nickel Chromium (Ni-Cr) Alloy Nanopowder/Nanoparticles, Purity: 99.95%, Size: < 90 nm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 2 wt% |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Hexaboride (LaB6) Micron Powder, High Purity: 99.95+%, Size: 200 mesh |
| Tantalum (Ta) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Nickel (Ni) Micron Powder Type 255, Purity: >99.7 %, APS: 2.2–2.8 μm |
| Carbon Nanotubes Doped with 12 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Beryllium (Be) Micron Powder, Purity: 99.5+%, Size: -100 mesh |
| Magnesium Nitride (Mg3N2) Micron Powder, Purity: 99.95%, Size: 35 µm |
| Tin Oxide (SnO2) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm |
| Hafnium Carbide (HfC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 32 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 32 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Copper (Cu) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 52 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2” , Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Niobium (Nb) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Cadmium Selenide (CdSe) Micron Powder, Purity: 99.9+%, Size: 1-10 µm |
| Carbon Nanotubes Doped with 52 wt% Iron (Fe) Nanopowder/Nanoparticles |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 1”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silicon (Si) and 32 wt% Graphene Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Dysprosium (Dy) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 1”, Thickness: 0.125” |
| Graphene NMP Dispersion, Purity: 99.5%, Graphene: 2,0 wt% |
| Carbon Nanotubes Doped with 32 wt% Aluminum (Al) Nanopowder/Nanoparticles |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Aluminum Zirconium Alloy Powder, Purity: 99.9+%, Size: < 44 µm, Al: 90%, Zr: 10% |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| SS304 Coin Cell Battery Spacer, Diameter: 15.8mm, Thickness: 1mm |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 1”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Nanopowder for Battery Applications |
| Yttrium Oxyfluoride (YOF) Nanopowder, Purity: 99.9%, APS: < 50 nm |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Yttrium Fluoride (YF3) Nanopowder, Purity: 99.9%, APS: < 50 nm |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size:1”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| (-OH) Functionalized Single Walled Carbon Nanotubes, Purity: > 92%, SSA: 370 m2/g, Dia: 1.0 nm |
| (-COOH) Functionalized Single Walled Carbon Nanotubes, Purity: > 92%, SSA: 370 m2/g |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| PPL Inside Chamber for Hydrothermal Synthesis Autoclave Reactors |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Water-_21_.webp |
| Diamond (C) Nanopowder/Nanoparticles, Purity: 99%, Size: 30-50 nm |
| Lanthanum Hexaboride (LaB6) Micron Powder, High Purity: 99.5+%, Size: 1.5-18 µm |
| Crystalline Boron (B) Micron Powder, Average Particle Size: -325 Mesh, Purity: 99+% |
| Aluminum 2024 Alloy Powder, Size: – 325 mesh |
| Aluminum 6061 Alloy Powder, Size: 15-53 µm, Spherical |
| N-Methyl-2-Pyrrolidone (NMP) Solvent for Lithium Battery Cathode Materials, Purity: 99.90% |
| Carbon Nanotube-Polystyrene Microspheres Prepared by Electrostatic Adsorption, CNTs: 25 wt%; Polystyrene Microspheres: 75 wt% |
| Niobium (Nb) Micron Powder, Purity: 99.95%, Size: 325 mesh |
| Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 100 mesh, Spherical |
| Hafnium (Hf) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| View Product |
| Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 2-Propanol, Size: 12 nm, Anatase, 22 wt% |
| Cobalt Chromium (Co-Cr) Alloy Powder, Size: < 44 µm, Co: 20%, Cr: 80% |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Ni-Ti50 Alloy Powder / Solid Spherical Micron Powder, Purity: 99.9%, APS: 45-105 μm |
| WE43 Magnesium Alloy Average Particle Size: 15-53 um, Spherical |
| Zirconium (Zr) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Crystalline Boron (B) Micron Powder, Average Particle Size: 5 µm, Purity: 99+% |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Lithium Lanthanum Tantalum Zirconate (LLZTO), Size: 1-3 µm, Purity: ≥99.5 |
| Graphite Sheet Thermal Interface Material, EYG Series, 1300 W/m.K, Thickness: 50 µm, Lenght: 230 mm, Width: 180 mm |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 31 nm, Metal Basis |
| Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 90 nm, Metal Basis |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 52 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Carbon Nanotubes Doped with 12 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles, Purity: 99.9% , Size: < 500 nm |
| Aluminum Nitride (AlN) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Hexagonal |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Carbon Nanotube-TiO2 Prepared by Electrostatic Adsorption, CNTs: 25 wt%, TiO2-rutile: 75 wt% |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 32 wt% Silver (Ag) Nanopowder/Nanoparticles |
| Molybdenum (Mo) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 50-150 nm, Metal Basis |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.125” |
| Lead Zirconate Titanate (PZT) Nanopowder/Nanoparticles, Purity: 99.5+ %, Size: < 100 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 3”, Thickness: 0.250” |
| Crystalline Boron (B) Micron Powder, Average Particle Size: 1 µm, Purity: 99+% |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 279 ± 20 μm |
| Scandium (Sc) Micron Powder, Purity: 99.9 %, Particle Size: 200 mesh |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Amino-Multi Walled Carbon Nanotubes, Purity: > 95 wt%, Length: 60 μm |
| Carbon Nanotube Sponges, Size: 10 mm x 10 mm, Thickness: 1-2 mm |
| Scandium (Sc) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Carbon Nanotubes Metal Films with Iron (Fe) 13 wt%, Thickness: 18 µm, Diameter: 47 mm |
| Titanium Tin Carbide (Ti2SnC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Niobium Aluminum Carbide (Nb2AlC) MAX Phase Micron Powder, APS: 325 Mesh, Purity: 99+ % |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Bismuth (III) Sulfide (Bi2S3) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 500 nm |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 50 ml |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Micron Powder, Purity: 99.99 %, Size: 325 mesh, White |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 625±25um |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1-20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.250” |
| Titanium Foam for Battery and Supercapacitor Research, Purity: 99+%, Size: 100 mm x100 mm x 2.8mm |
| Carbon Nanotube Sponges, Size: 10 mm x 10 mm, Thickness: 3-4 mm |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Styrene-Butadiene Rubber (SBR) Binder for Li-ion Battery Anode Materials |
| Carbon Nanotube-Carbon Black Prepared by Electrostatic Adsorption, CNTs: 34.4 wt%, Carbon Black: 65.6 wt% |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Cubic Boron Nitride Nanopowder, Cubic, Size: <250 nm Purity: 99.5% |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 280 ± 15 μm |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Borosilicate Wafer, Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm |
| Carbon Nanotube Buckypaper with Metal 0.8%, Thickness: 28 µm, Diameter: 35-39 mm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Copper-Zinc Alloy Nanopowder, Cu55Zn45, Average Particle Size: 50nm, Purity: 99.9% |
| Lithium Battery Strapping Tape, Width: 10 mm, Thickness: 0.03 mm, Length: 100 m |
| Iron-Silicon Nanoparticles, Fe65Si35, APS:50nm, Purity: 99.9% |
| Iron-Nickel Nanoparticles, Fe65Ni35, APS: 50nm, Purity: 99.9% |
| Copper Nickel Alloy Nanopowder, Cu55Ni45, APS: 50nm, Purity: 99.9% |
| Aluminum-Silicon (AlSi) Alloy Powder, Al85Si15, APS: 50nm, Purity: 99.9% |
| Silver Indium (Ag-In) Alloy Nanopowder/Nanoparticles, Purity: 99.9%, Size: 40-100 nm |
| Vanadium Nitrade (VN) Nanopowder, APS: 40nm, Purity: 99.9% |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Dummy CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-50 (ohm.cm), 2-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 280 ± 25 μm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4 wt%, Purity: >96%, OD: 45-75 nm, Length 8-28 µm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 279 ± 20 μm |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: >96%, OD: 45-75 nm, Length 8-28 µm |
| CR2032 Coin Cell Cases with 304SS, Diameter: 20 mm, Height: 3.2 mm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Arsenic Doped, Resistivity: 0,001-,0.005 (ohm.cm), 1-Side Polished, Thickness: 400 ± 25 μm |
| Cobalt (II) Chloride Hexahydrate (Cl2CoH12O6), Purity: > 99% |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 2”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 380 ± 25 μm |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 770 nm, Metal Basis |
| Aluminum Tab for Pouch Li-ion Cell, Width: 4 mm, Length: 57 mm |
| Quartz Wafer, (X-Cut), Size: 2”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Test CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-20 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Borosilicate Wafer, Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm |
| Dummy CZ-Si Wafer, Size: 3”, Orientation: (111), Phosphor Doped, Resistivity: 0,001-100 (ohm.cm), 1-Side Polished, Thickness: 340 ± 25 μm |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 380±25um |
| Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 700 ± 25 μm |
| Carbon Nanotubes Highly Conductive Tapes with Metal 8%, Thickness: 18 µm, Dia: 47 mm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Carbon Nanotubes Doped with 12 wt% Silicon (Si) Nanopowder/Nanoparticles |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 2”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Platinum (Pt) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 10 nm, 1100 ppm |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| CR2032 Coin Cell Case (Negative Case, Cone Spring, Spacer, Positive Case) |
| Thulium (III) oxide Micron Powder, Size: 3-5 um, Purity: 99.9 % |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Cubic Boron Nitride Nanopowder, Cubic, Size: <200 nm Purity: 99.9% |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80 nm, Metal Basis |
| Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt% |
| Reduced Graphene Oxide Water Dispersion, Purity: 99.5%, rGO: 2,0 wt% |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 625±25um |
| Short Single Walled Carbon Nanotubes, Purity: > 92% |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Graphite Fluoride (Carbon Monofluoride) Micron Powder, 8-10 micron, F/C Ratio : 1.2 |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Tantalum (Ta) Nanopowder/Nanoparticles, High Purity: 99.9%, Size: 45-75 nm |
| Large Surface Area Single Walled Carbon Nanotubes, Purity: > 95%, SSA: 400 m2/g |
| Prime Si+SiO2 Wafer (dry), Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 279 ± 20 μm, Coating 100 nm |
| (-OH) Functionalized Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Lithium Lanthanum Zirconate (LLZO, Li7La3Zr2O12), Purity: ≥99.5, Size: 0.3 -1 µm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (110), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 525 ± 25 μm |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 100 (ohm.cm), 1-Side Polished, Thickness: 650 ± 50 μm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Phosphor Doped, Resistivity: 0.001 – 100 (ohm.cm), 1-Side Polished, Thickness: 650 ± 50 μm |
| Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 1000 ± 20 μm |
| Platinum Oxide (PtO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: <100 nm |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99% Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 35 nm, Metal Basis |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Thulium (Tm) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 2”, Thickness: 0.250” |
| Single Layer Graphene Oxide, Purity: 99.5 % |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.125” |
| (-COOH) Functionalized Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Antimony (Sb) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| CR2016 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 20 mm, Height : 1.6 mm |
| CR2325 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 23 mm, Height : 2.5 mm |
| Tin (Sn) Micron Powder, Purity: 99.95 %, Size: 3 µm |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 3”, Thickness: 0.125” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime FZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 7000 – 8000 (ohm.cm), 2-Side Polished, Thickness: 250 ± 15 μm |
| Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 2000 ± 50 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 8-12 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm |
| Prime Si+SiO2 Wafer (wet), Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1 -20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm, Coating 500 nm |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 50 ml |
| Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 30-40 nm, Metal Basis |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| (-OH) Functionalized Short Single Walled Carbon Nanotubes, Purity: >92% |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Niobium (Nb) Sputtering Targets, Purity: 99.95% pure Ex Ta, Size: 3”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 350± 25 μm, Single Side Polished, EPI-ready, Mobility: 1000-3000 |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready, Dopant: Zinc (P Type) |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Scandium Oxide (Sc2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 0,01-0,02 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime Si+SiO2 Wafer (wet), Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 380 ± 25 μm, Coating 300 nm |
| Prime Si+SiO2 Wafer (dry), Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 380 ± 25 μm, Coating 100 nm |
| Test CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0,001-0,005 (ohm.cm), 2-Side Polished, Thickness: 200 ± 10 μm |
| Dummy CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 5-10 (ohm.cm), 1-Side Polished, Thickness: 675 ± 25 μm |
| Iron (II) Sulfate (FeSO4.xH2O), Purity: > 98% |
| CR2450 Coin Cell Cases with 304SS (Positive+Negative Cases), Diameter: 24 mm, Height : 5 mm |
| Aluminum 7075 Alloy Powder, Size: 15-53 µm, Spherical |
| Silver Conductive Adhesive Paste |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 100 ml |
| Magnetic Graphene Aerogel, Content of Fe3O4: 65%, Diameter: 1±0.1 cm |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 1×1 cm |
| Magnetic Graphene Aerogel, Content of Fe3O4: 50%, Diameter: 1±0.1 cm |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 0.005 (ohm.cm), 2- Polished, Thickness: 200 ± 10 μm |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 700 ± 20 μm |
| Hafnium (Hf) Micron Powder, Purity: 99.9+%, Size: 15-53 μm, Spherical |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2- Polished, Thickness: 200 ± 10 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0,01-0,02 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 300 ± 25 μm |
| Graphitized Carbon Nanofibers, Purity: > 99.9%, Outside Diameter: 50-100 nm, Length: 1-15 μm |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 25 μm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: NG08SW0227 400±25um |
| CR2032 Coin Cell Case (Negative Case, Cone Spring, Spacer, Positive Case), Materials: 316SS |
| Carbon Nanotube (CNT) Nanoribbon |
| Ultralight Graphene Aerogel, Diameter: 1.2±0.1 cm, Height: 1.2±0.1 cm |
| Lithium Cobalt Oxide (LiCoO2) Coated Aluminum Foil |
| Lithium Iron Phosphate (LiFePO4) Coated Aluminum Foil |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Silicon Hexaboride (SiB6) Nanopowder, APS: 40nm, Purity: 99% |
| Carbon-Coated Aluminum Foil |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Strong Graphene Aerogel, Diameter: 1.2±0.1 cm, Height: 1.2±0.1 cm |
| Carbon Nanotubes(CNT) Modified Graphene Aerogel, Diameter: 1.2±0.1cm, Height: 1.2±0.1cm |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 3”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (wet), Size: 3”, Orientation: (111), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 381 ± 25 μm, Coating 500 nm |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.250” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 100 ml |
| Nickel Foam for Battery Cathode Substrate, Size: 1000 mm x 300 mm x 1.6 mm |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Large Inner Diameter Thin Multi-Wall Carbon Nanotubes, Purity: > 92%, OD: 28-58 nm, ID: 18-48 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (dry), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 200 nm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 2-Side Polished, Thickness: 500 ± 15 μm, Coating 300 nm |
| Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 0.05 – 0.152 (ohm.cm), 2-Side Polished, Thickness: 365 ± 15 μm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 300 nm |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 400 nm |
| Mesocarbon Microbeads (MCMB) Graphite Micron Powder for Lithium Ion Battery |
| Fused Silica Wafer, Size: 4”, 2-Side Polished, Thickness: 1000 ± 25 μm |
| Fused Silica Wafer, Size: 10mm x 20mm, 2-Side Polished, Thickness: 500 ± 00 μm, |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| (-COOH) Functionalized Short Length Single Walled Carbon Nanotubes, Purity: > 92% |
| CR2032 Coin Cell Cases with 316SS, Diameter: 20 mm, Height: 3.2 mm |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (111), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 625±25um |
| Silver (Ag) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 14 nm, 52000 ppm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 5”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Short Length Double Walled Carbon Nanotubes, Purity: > 65% |
| Single Walled Carbon Nanotubes, Purity: > 96%, Dia: 1.0 nm |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Carbon Nanotubes Metal Tapes with Copper (Cu) 13 wt%, Thickness: 22 µm, Dia: 47 mm |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotubes Metal Films with Copper (Cu) 14 wt%, Thickness: 18 µm, Dia: 47 mm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 500±25um |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Chromium (Cr) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 30-40 nm, Metal Basis |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.250” |
| Magnetic Fe2O3@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Positively-charged |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Prime CZ-Si Wafer, Size: 6”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525±25um |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime Si+SiO2 Wafer (dry), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 -10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 100 nm |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125”, Dark Gray to Black |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 20 μm |
| Graphite Plate, Purity: 99.99%, D: 100mm x 20mm |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 2000 – 4000 (ohm.cm), 1-Side Polished, Thickness: 300 ± 10 μm |
| Magnetic Fe2O3@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Negatively-charged |
| Magnetic Fe3O4@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Positively-charged |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.125” |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 1×1 cm |
| Magnetic Fe3O4@SiO2 powder, Size: 250 nm, Core size: 45 nm, Shell size: 205 nm, Negatively-charged |
| Borosilicate Wafer, Size: 6”, 1-Side polished, Thickness: 700 ± 25 μm |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| 18650 Cylinder Cell Case |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 1×1 cm |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| AZ31 Spherical Magnesium Alloy Powder, Size: 15-53 µm, Purity: > 95 % |
| PE Separator Film for Battery Applications Thickness: 12μm, Width: 60mm, Length: 500 m, 1 roll: 500 m |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Titanium (Ti) Nanopowder/Nanoparticles, Purity:99.9+%, Size: 80-120 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 6”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, White to Gray |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 2”, Thickness: 0.250” |
| CR2016 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 20 mm, Height : 1.6 mm |
| Water-_17_.webp |
| Hafnium Diboride Micron Powder, Purity: 99.5 %, Size: 1-3 μm |
| CR2450 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 24 mm, Height : 5 mm |
| Chromium (Cr) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: 100 nm, Metal Basis |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 200 ± 20 μm |
| Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Borosilicate Wafer, Size: 6”, 2-Side polished, Thickness: 700 ± 20 μm |
| CR2325 Coin Cell Cases with 316SS (Positive+Negative Cases), Diameter: 23 mm, Height : 2.5 mm |
| Prime CZ-Si Wafer, Size: 8”, Orientation: (100), Phospor Doped, Resistivity: 0.001-0.005 (ohm.cm), 1-Side Polished, Thickness: 725 ± 20 μm |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, Grey to Black |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles, Size: 55 nm, Ni:Ti/50:50 |
| (-COOH) Functionalized Double Walled Carbon Nanotubes, Purity: > 65% |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| 18650 Nickel Strip for Battery Tab, Width: 4 mm, Thickness: 0.1 mm, 1 Roll: 1 kg |
| Prime Si+Si3N4 Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 381± 25 μm, Coating 150 nm |
| Carbon Nanotubes Highly Conductive Films, Thickness: 10-20 µm, Dia: 120-130 mm |
| Magnetic Fe2O3@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Positively-charged |
| Magnetic Fe2O3@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Negatively-charged |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 1000 nm |
| Vanadium (V) Micron Powder, Purity: 99.9 %, Size: 325 mesh |
| Borosilicate Wafer, Size: 6”, 2- Side polished, Thickness: 1100 ± 20 μm |
| Lithium Cobalt Oxide (LiCoO2) Powder for Li-ion Battery Cathode Application |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 380± 15 μm, Coating 150 nm |
| High Quality Natural Agate Mortar and Pestle, Size: 4″ |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Positively-charged |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 6”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Magnetic Fe3O4@SiO2 powder, Size: 150 nm, Core size: 22 nm, Shell size: 128 nm, Negatively-charged |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 8”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 1500 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Magnetic Graphene Aerogel, Content of Fe3O4: 65%, Diameter: 2±0.4 cm |
| Magnetic Graphene Aerogel, Content of Fe3O4: 50%, Diameter: 2±0.4 cm |
| Lutetium Oxide (Lu2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh |
| Magnetic Fe2O3@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Positively-charged |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Ultralight Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Aluminum Foil for Battery Cathode Substrate, Size: 350 m*280 mm*15 µm |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Graphene Sample Pack (Includes 9 products) |
| Magnetic Fe3O4@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Positively-charged |
| Magnetic Fe2O3@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Negatively-charged |
| Prime Si+SiO2 Wafer (wet), Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 0.01 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm, Coating 500 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”, Dark Gray to Black |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Titanium (Ti) Nanopowder/Nanoparticles, Purity: 99.9+%, Size: 30-80 nm |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Magnetic Fe3O4@SiO2 powder, Size: 100 nm, Core size: 30 nm, Shell size: 70 nm, Negatively-charged |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 525± 25 μm, Coating 70 nm |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: > 96%, OD: 18-28 nm, Length: 8-18 µm |
| Carbon Nanotubes(CNT) Modified Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 35-55 nm, Metal Basis |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/92:8 |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/1:9 |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 5”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 4 wt%, Purity: > 96 %, OD: 45-75 nm,Length 8-28 µm |
| Magnetic Fe2O3@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Positively-charged |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 525± 25 μm, Coating 150 nm |
| Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”, Grey to Black |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”, White to Gray |
| Silicon (Si) Nanopowder/Nanoparticles, Purity: 97+%, Size: 25-35 nm, Oxygen Content: < 3% |
| Magnetic Fe3O4@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Positively-charged |
| Ãrün-Görselleri-_6_.webp |
| Holey Super Graphene |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Magnetic Fe2O3@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Negatively-charged |
| Cobalt Acetate (C4H6CoO4), Purity: > 98% |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 50 nm, Core size: 20 nm, Shell size: 30 nm, Negatively-charged |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3”, Thickness: 0.125” |
| Gadolinium (Gd) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Fused Silica Wafer, Size: 4”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Fused Silica Wafer, Size: 6”, 2-Side Polished, Thickness: 700 ± 25 μm |
| Prime Si+Si3N4 Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 381± 25 μm, Coating 300 nm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (111), None Doped, Resistivity: 10000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 300 ± 20 μm |
| Carbon Nanotube Fibres, Fiber diameter: 60-80 µm, Tensile Strength: 310-500 MPa, Electrical conductivity: 1×10^5~2×10^5 S/m |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Iron Nickel Cobalt (Fe-Ni-Co) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Fe:Ni:Co/55:28:17 |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 2×2 cm |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 3”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Molybdenum Aluminum Boride (MoAlB) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Magnetic Fe2O3@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Positively-charged |
| Prime Si+SiO2 Wafer (dry), Size: 6”, Orientation: (100), Boron Doped, Resistivity: 1 – 10 (ohm.cm), 2-Side Polished, Thickness: 675 ± 15 μm, Coating 200 nm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), None Doped, Resistivity: 1000 – 10000 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm |
| Strong Graphene Aerogel, Diameter: 2±0.4 cm, Height: 2±0.4 cm |
| Vanadium (V) Micron Powder, Purity: 99.9 %, Size: 100 mesh |
| Flash-Ignited Multi-Walled Carbon Nanotubes, MWCNTs: 48 wt%, Fe Nanoparticles: 23 wt%, Amorphous Carbon: 23 wt% |
| Aluminum Laminated Film, Width: 400 mm, Length: 7.5 m |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Magnetic Fe2O3@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Negatively-charged |
| Nickel(II) Nitrate Hexahydrate (Ni(NO₃)₂*6H₂O), Purity: > 98% |
| Silver (Ag) Nanopowder/Nanoparticles Water Dispersion, Size: 15 nm, Tawny Color, 55.000 ppm |
| Magnetic Fe3O4@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Negatively-charged |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles Dispersion in 2-Propanol, Gamma, Size: 12 nm, 12 wt% |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 3000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 200 ± 10 μm |
| Prime FZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 5000 – 500000 (ohm.cm), 2-Side Polished, Thickness: 300 ± 10 μm |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Boron Oxide (B2O3) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: 50 nm |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 80 ppm Dry powder |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Hand-Held Disc Cutter with Ring Cutting Dies, ID: 8,15,18,20 mm |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Aluminum Nickel Composite Strip for Battery Tab, Width: 4 mm, Thickness: 0.1 mm, 1Roll: 1 kg |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 28 nm, Carbon Coated |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientation: (100), Arsenic Doped, Resistivity: 0,001-0,005 (ohm.cm), 1 Side Polished, Thickness: 525± 25 μm, Coating 450 nm |
| Prime FZ-Si Wafer, Size: 3”, Orientation: (100), None Doped, Resistivity: 10000 – 100000 (ohm.cm), 2-Side Polished, Thickness: 380 ± 25 μm |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 3 wt%, Purity: > 95%, OD: 18-28 nm, Length: 8-28 µm |
| Selenium (Se) Sputtering Targets, elastomer, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Carbon Nanotubes Highly Conductive Films with Metal 8%, Thickness: 18 µm, Dia: 47 mm |
| Multi Walled Carbon Nanotubes N-butanol Dispersion, 4 wt%, Purity: > 95%, OD: 8-16 nm, Length: 45 µm |
| Multi Walled Carbon Nanotubes Ethanol Dispersion, 4 wt%, Purity: > 96%, OD: 3-13 nm, Length: 45 µm |
| Carbon Nanotubes Metal Films with Nickel (Ni) 12 wt%, Thickness: 18 µm, Dia: 47 mm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4wt%, Purity: > 96%, OD: 4-12 nm, Length: 55 µm |
| Multi Walled Carbon Nanotubes N-Methyl-2-Pyrrolidinone Dispersion, 4 wt%, Purity: > 96%, OD: 4-13 nm, Length: 45 µm |
| Multi Walled Carbon Nanotubes Isopropanol Dispersion, 4 wt%, Purity: > 95%, OD: 18-35 nm, Length: 8-18 µm |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size:3”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 1”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 4”, Thickness: 0.250” |
| Boron Doped Graphene Nanopowder (B/G) |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Quartz Wafer, (AT-Cut), Size: 4”, 2-Side Polished, Thickness: 500 ± 25 μm |
| Quartz Wafer, (ST-Cut), Size: 4”, 1-Side Polished, Thickness: 625 ± 25 μm |
| Carbon Nanotube Wire, Diameter: 30-50 μm, Hardness: 1.0-1.5 GPa |
| Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Quartz Wafer, (X-Cut), Size: 4”, 2-Side Polished, Thickness: 300 ± 25 μm |
| Copper Tin (Cu-Sn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Sn:Cu/9:1 |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 3”, Thickness: 0.125” |
| Water-_20_.webp |
| Diamond (C) Nanopowder/Nanoparticles, Purity: 99%, Size: 10 nm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 100 mesh |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-200 µm |
| Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW120 |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Aluminum Laminated Film for Pouch Cell Case |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| PTFE Separator Film for Battery Applications Thickness: 50μm, Width: 60mm, Length: 600 m, 1 roll: 600 m |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 20 mm x 20 mm, Thickness: 1-2 mm |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 130 ppm Dry powder |
| Li-Ion Battery Separator Film, Thickness: 25 μm, Width: 60 mm, Length: 500 m, 1 Roll: 500 m |
| Copper Zinc (Cu-Zn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Cu:Zn/6:4 |
| Iron Nickel (Fe-Ni) Alloy Nanopowder/Nanoparticles, Size: 30-90 nm, Fe:Ni/5:5 |
| Copper Zinc (Cu-Zn) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Cu:Zn/5:5 |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-100 µm |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 5 µm |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW60 |
| Fullerene-C60, Purity: 95% |
| Nickel (Ni) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 4”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 2”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 10 mm, Thickness: 1-2 mm |
| Carbon Nanotube Fibres, Fiber diameter: 5-12 µm, Tensile Strength: 800-1000 MPa, Electrical conductivity: 5×10^4~7×10^4 S/m |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 60-100 μm, Hardness: 350-500 MPa |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 120-150 μm, Hardness: 350-500 MPa |
| Iron (II) Acetate Fe(C2H3O2)2, Purity: > 95% |
| Nickel Foil, Purity: 99.9+% , Thickness: 0.03mm, Width: 100mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Indium (In) Micron Powder, Purity:99.99%, APS:1-5 µm, Spherical |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Iron Chromium Cobalt (Fe-Cr-Co) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Fe:Cr:Co/64:25:11 |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4”, Thickness: 0.125” |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 18 nm, Laser Synthesized |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, Grey to Black |
| Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”, Dark Gray to Black |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Carbon Nanotube Sponges, Size: 20 mm x 20 mm, Thickness: 3-4 mm |
| Borosilicate Wafer, Size: 8”, 2-Side Polished, Thickness: 1250 ± 25 μm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Fullerene-C60, Purity: 98% |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Nickel Foil, Purity: 99.9+% , Thickness: 0.08mm, Width: 100mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.250” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”, White to Gray |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Prime Si+Si3N4 Wafer, Size: 4”, Orientaion: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2 Side Polished, Thickness: 380± 15 μm, Coating 1000 nm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 4”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Chromium Aluminum Boride (Cr2AlB2) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Shape Memory Polymer NGM9020, Ether Type |
| Platinum (Pt) Nanopowder/Nanoparticles, Purity: 99.9%, Size: 15 nm |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Copper-Carbon Nanotube Fibers Composite Wires, Cu-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1×10^7 S/m |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 6”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Shape Memory Polymer NGM7520, Ether Type |
| Fullerene-C60, Purity: 99% |
| Shape Memory Polymer NGS2520, Solution Type |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350±25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW40 |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 250 ppm Dry powder |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Iron Aluminum Boride (Fe2AlB2) Max Phase Powder, Purity: 99+%, Size: 200 mesh |
| Silver-Carbon Nanotube Fibers Composite Wires, Ag-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1.5×10^7 S/m |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 50-100 nm |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Quartz Wafer, (X-Cut), Size: 4”, 2-Side Polished, Thickness: 200 ± 25 μm |
| Hafnium Oxide (HfO2) Pellet, Granule Type, Color: Black, Purity: 99.99%, Size: 1-3mm |
| Hafnium Oxide (HfO2) Pellet, Granule Type, Color: White, Purity:99.99%, Size:1-3mm |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 450±25 μm, Single Side Polished, EPI-ready, Dopant: Silicon (N Type) |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Sulphur (S) Nanopowder/Nanoparticles, High Purity: 99.995%, Size: 47 nm |
| Fullerene-C60, Purity: 99.5% |
| Shape Memory Polymer NGM6520, Ether Type |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6”, Thickness: 0.250” |
| Shape Memory Polymer NGM5520, Ether Type |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”, Dark Gray to Black |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, White to Gray |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Graphene Sheet, Size: 29 cm x 39 cm, Thickness: 35 µm, Highly Conductive |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Shape Memory Polymer NGM4520, Ether Type |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Grey to Black |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 38 nm, Metal Basis |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 450 nm |
| Thermoplastic Carbon Paste, Drying Temperature: <100 °C |
| Quantum Dots Magnetic Microspheres 615 nm |
| Quantum Dots Magnetic Microspheres 525 nm |
| Quantum Dots Microspheres 615 nm |
| Quantum Dots Microspheres 525 nm |
| Water Soluble Carbon Quantum Dots 528 nm |
| Water Soluble Carbon Quantum Dots 515 nm |
| Water Soluble Carbon Quantum Dots 505 nm |
| Water Soluble Carbon Quantum Dots 420 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 645 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 625 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 545 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 525 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 500 nm |
| Water Soluble Cadmium Selenide Quantum Dots (CdSe/ZnS) 470 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 700 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 625 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 600 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 560 nm |
| Water Soluble Indium Phosphide Quantum Dots (InP/ZnS QD) 525 nm |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Double Side Polished, EPI-ready, Dopant: Zinc (P Type) |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 10 mm, Thickness: 3-4 mm |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Bismuth (Bi) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 78 nm, Metal Basis |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silver Conductive Paste, Surface Curing: ~80℃ |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 400±25 μm, Double Side Polished, EPI-ready |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Thermoplastic Carbon Paste for Long-term Cell Degradation |
| Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.250” |
| Carbon Nanotube Wire, Diameter: 5-15 μm, Hardness: 1.0-1.5 GPa |
| High-Performance Copper Foil Rolls for Lithium Ion Battery, Size: 10 µm |
| Cobalt Oxalate (CoC2O4), Purity: > 98% |
| High Purity Atomized Spherical Magnesium (Mg) Powder NGW20 |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Fullerene-C60, Purity: 99.9% |
| Meshed Lithium Air CR2032 Coin Cell Case with 304SS, Diameter: 20 mm, Height: 3.2 mm |
| Thermoset Carbon Paste (140 ℃, 100 ohm/sqr/25µm), 15-20 µm |
| Thermoset Carbon Paste (140 ℃, 1000 ohm/sqr/25µm, 10-15 µm) |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Thermoplastic Carbon Paste, Drying Temperature: 120˚C for 10 minutes |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness:0.125” |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Shape Memory Polymer NGM2520, Ether Type |
| Thermoset Carbon Paste (140℃, <20 ohm/sqr/25µm), 10-12 µm |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”, Grey to Black |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”, Grey to Black |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Hydrothermal Synthesis Autoclave Reactor with PTFE Lined Vessel 500 ml |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.125” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”, Grey to Black |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 3”, Thickness: 0.125” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 28 nm |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, elastomer, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.125” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.125” |
| Carbon Nanotube Fibres, Fiber Diameter: 5-12 µm, Tensile Strength 1000-1200 MPa, Electrical conductivity 5×10^4~7×10^4 S/m |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Lithium Nickel Cobalt Oxide (LiNi(1-x)CoxO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”, Grey to Black |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| High-Performance Copper Foil Rolls for Lithium Ion Battery, Size: 25 µm |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium (In) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 70 nm, Tetragonal |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.250” |
| Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 8”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Li-Ion Battery Separator Film, Length: 800 m, Width: 85 mm, Thickness: 25 μm |
| Stainless Steel Two-Electrode Split Test Cell |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Zinc Selenide Quantum Dots (ZnSe/ZnS QD) 450 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 700 nm |
| Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 500 ppm Dry powder |
| Gold-Carbon Nanotube Fibers Composite Wires, Au-CNT, Diameter: 10-30 µm, Coating Thickness: 1 µm, Electrical conductivity: 1×10^7 S/m |
| Indium Phosphide Quantum (InP/ZnS QD) Dots 625 nm |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Zinc Selenide Quantum Dots (ZnSe/ZnS QD) 420 nm |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.250” |
| Gold (Au) Nanopowder/Nanoparticles, Purity: 99.99+%, Size: 14 nm |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 4”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Indium Phosphide Quantum (InP/ZnS QD) Dots 600 nm |
| Boron Carbide (B4C) Sputtering Targets, Purity: 99.5, Size: 8”, Thickness: 0.250” |
| Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Ytterbium Oxide (Yb2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Electrolyte Lithium Hexafluorophosphate (LiPF6) for Lithium-ion Battery Research Development, 1 Kg in Stainless Steel Container |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 560 nm |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”, Beige to White |
| Silver Nanowires Suspension in Ethanol, Purity: > 99 wt%, Diameter : 50 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, White to Gray |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 525 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 500 ml |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Indium Phosphide Quantum Dots (InP/ZnS QD) 480 nm |
| Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Vanadium Oxide (V2O5) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Shape Memory Polymer NGM3520, Ether Type |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 7”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 1”, Thickness: 0.125” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Lithium (Li) Foil Thickness:0.5 mm, Width: 50 mm, Length: 1000 mm, Purity: 99.9% |
| Vanadium Oxide (VO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 30-60 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 3”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 645 nm |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”, Dark Gray to Black |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 625 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Nickel Cobalt Oxide (LiNi(1-x)CoxO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 640±25 μm, Single Side Polished, EPI-ready, Dopant: Silicon (N-type) |
| Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 545 nm |
| Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”, Grey to Black |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 960 µm |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 180 µm |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 960 µm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 960 µm |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 525 nm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 490 µm |
| Multi Walled Carbon Nanotubes Array on Quartz, Height: 95 µm |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 95 µm |
| Zinc (Zn) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Carbon Nanotube Fibres, Fiber Diameter: 5-12 µm, Tensile Strength 1200-1500 MPa, Electrical conductivity 5×10^4~7×10^4 S/m |
| Multi Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 95 µm |
| Chromium Oxide (Cr2O3) Sputtering Targets, indium, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Multi Walled Carbon Nanotubes Array on Polycrystal Silicon, Height: 490 µm |
| Carbon Nanotube Sponges, Size: 50 mm x 20 mm, Thickness: 1-2 mm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 480 nm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”, Dark Gray to Black |
| Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 460 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Indium (In) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”, Beige to White |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Prime CZ-Si Wafer, Size: 8”, Orientation: (100), Boron Doped, Resistivity: 1-100 (ohm.cm), 1-Side Polished, Thickness: 725 ± 25 μm |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| CQD-675-nm.webp |
| Carbon Quantum Dots (CQD) 675 nm |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Zinc Oxide (ZnO) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Carbon Quantum Dots (CQD) 630 nm |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 1000 ppm Dry powder |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4”, Thickness: 0.125” |
| Vanadium (V) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Single Side Polished, EPI-ready, Mobility: 1000-3000 |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350±25 μm, Double Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 100, Single Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 625±25 μm, Single Side Polished, EPI-ready |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 350±25 μm, Single Side Polished, EPI-ready |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9% , Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, elastomer, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| 565.webp |
| Carbon Quantum Dots (CQD) 565 nm |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size:2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 5×5 cm |
| Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Yttrium (Y) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Samarium (Sm) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| 535.webp |
| Carbon Quantum Dots (CQD) 535 nm |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 2”, Thickness: 0.250” |
| Germanium (Ge) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 1”, Thickness: 0.125” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cobalt (Co) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 100 nm |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Carbon (C) (Pyrolytic Graphite) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| 515.webp |
| Carbon Quantum Dots (CQD) 515 nm |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250” |
| Lead Sulfide Quantum Dots (PbS QD) 1550 nm |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| 505.webp |
| Carbon Quantum Dots (CQD) 505 nm |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| 440.webp |
| Carbon Quantum Dots (CQD) 440 nm |
| Lead Sulfide Quantum Dots (PbS QD) 1450 nm |
| Gallium Arsenide (GaAs) Wafers, Size: 4”, Thickness: 600±25 μm, Double Side Polished, EPI-ready |
| Perovskite Quantum Dots (CsPbI3) 670 nm |
| Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:2”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 1350 nm |
| Fullerene-C70, Purity: 95% |
| Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| 420.webp |
| Carbon Quantum Dots (CQD) 420 nm |
| Lead Sulfide Quantum Dots (PbS QD) 1250 nm |
| Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4”, Thickness: 0.250” |
| Lead Sulfide Quantum Dots (PbS QD) 1150 nm |
| Perovskite Quantum Dots (CsPbCl3) 410 nm |
| Perovskite Quantum Dots (CsPbBr3) 510 nm |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”, Beige to White |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 1050 nm |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Sulfide Quantum Dots (PbS QD) 950 nm |
| Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Carbon Nanotube Sponges, Size: 50 mm x 20 mm, Thickness: 3-4 mm |
| Lead Sulfide Quantum Dots (PbS QD) 850 nm |
| Germanium (Ge) Micron Powder, Purity: 99.99 %, Size: 325 mesh |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size:1”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, elastomer, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.125” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” , Grey to Black |
| Strontium Titanate (SrTiO3) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Fullerene-C70, Purity: 96% |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Grey to Black |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Gallium Arsenide (GaAs) Wafer, Size: 4”, Thickness: 300± 25 μm, Double Side Polished, EPI-ready |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Boron Carbide (B4C) Sputtering Targets, Indium Bonding, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| InP-based QLED Quantum Dots 525 nm |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Cd-based QLED Quantum Dots 465 nm |
| Cd-based QLED Quantum Dots 525 nm |
| Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250” |
| Cd-based QLED Quantum Dots 625 nm |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| ZnSe-based QLED Quantum Dots 455 nm |
| InP-based QLED Quantum Dots 625 nm |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, indium, Purity: 99.8%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Multi-Layer Accordion-Shaped Titanium Carbide ( Ti3C2Tx) MXene Phase Powder, Purity: 98+%, Size: ~400 mesh |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”, Beige to White |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, Beige to White |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Gold Nanostars, Size: 40-45 nm |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125”, Grey to Black |
| Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Zinc Oxide (ZnO) with Alumina Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Vanadium Oxide (V2O5) Sputtering Targets, elastomer, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Fullerene-C70, Purity: 98% |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.98%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide (SiC) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Zinc Sulfide (ZnS) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-4H) – 4H , Size: 2”, Thickness: 350 μm, Mechanical Grade, 4H Area: 80% |
| Single Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 95 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 190 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 290 µm |
| Single Walled Carbon Nanotubes Array on Quartz, Height: 95 µm |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Chips for Coin Cell Materials, Diameter: 16 mm, Thickness: 0.6 mm, 1500 pieces |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.125” |
| Molybdenum Disilicide (MoSi2) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 4”, Thickness: 0.125” |
| Fullerene-C70, Purity: 99% |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”, Beige to White |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Manganese (Mn) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%, Size: 4”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Single Walled Carbon Nanotubes Array on Monocrystal Silicon, Height: 190 µm |
| Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size:4”, Thickness: 0.250” |
| Calcium Manganate (CaMnO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Stainless Steel Three-Electrode Split Test Cell |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 2000 ppm Dry powder |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 5”, Thickness: 0.250” |
| Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125” |
| Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Praseodymium (Pr) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.125” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Magnetic Fe3O4@SiO2 powder, Size: 20 nm, Core size: 12 nm, Shell size: 8 nm, Positively-charged |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lanthanum Nickel Oxide (LaNiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125” |
| Bismuth Ferrite (BiFeO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Cerium (Ce) Micron Powder, Purity: 99.5 %, Size: 325 mesh |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 5×10 cm |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.250” |
| Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 4”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”, Beige to White |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250” |
| Mini Pellet Press |
| Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”, Beige to White |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125” |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125” |
| Glassy Carbon Foam for Battery and Supercapacitor Research, Purity: 95+%, Size: 100 mm x100 mm x 10 mm |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”, Beige to White |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”, Beige to White |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Cerium Oxide (CeO2) Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Zinc Selenide Discs, Purity: 99.99%, Dia:20mm, Thickness:3mm, 2-side polished |
| Indium Phosphide (InP) Wafers, Size: 2”, Thickness: 350± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Multi-Layer Titanium Carbide (Ti2CTx) MXene Phase Powder, Purity: 98+%, Size: 2-20 µm |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250” |
| Selenium (Se) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: < 100 nm |
| Silicon Carbide Wafer (SiC-4H)- 4H, Size: 2”, Thickness: 350 μm, Mechanical Grade, 4H Area: 95% |
| Praseodymium Calcium Manganate (Pr0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 2”, Thickness: 350 μm, Testing Grade, 4H Area: 80% |
| Fullerene-C70, Purity: 99.5% |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Production Grade, 4H Area: 100% |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.125” |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| 5V-10mA Coin Cell Battery Testing System, Dimension ( W*L*H) : 480*330*45 mm |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dispersed in Water, 4000 ppm Dry powder |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Testing Grade, 4H Area: 95% |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”, Beige to White |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Dummy Grade, 4H Area: 95% |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250” |
| Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250” |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 111, Testing Grade |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, Testing Grade |
| Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250” |
| Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” |
| High Speed Homogenizer, 27.000 rpm |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125” |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125” |
| Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125” |
| Silicon Nanowires, Dia: 100-200nm, Length: >10um, Purity: 99% |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250” |
| Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.99%, Size: 4”, Thickness: 0.125”, Beige to White |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 5×5 cm |
| Fullerene-C70, Purity: 99.9% |
| Coin Cell Punching Machine |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Strontium Titanate (BaO4SrTi) Sputtering Targets, elastomer, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Tungsten Oxide (WO3) Sputtering Targets, indium, Purity: 99.9%, Size: 4”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-6H) – 6H , Size: 2”, Thickness: 350 μm, Dummy Grade, Usable Area: 95% |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Barium Fluoride (BaF2) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125” |
| Silicon Carbide Wafer (SiC-4H)- 4H , Size: 4”, Thickness: 350 μm, Dummy Grade, 4H Area: 95% |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Mechanical Grade, 4H Area: 80% |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 111, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, EPI-Ready |
| Platinum (Pt) Sputtering Targets, indium, Purity: 99.99%, Size:2”, Thickness: 0.125” |
| Hydraulic Crimping Machine for All Coin Cells |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 2”, Thickness: 350 μm, Production Grade, 4H Area: 1 |
| Shape Memory Polymer NGP4510, Potting Type |
| Shape Memory Polymer NGP5510, Potting Type |
| Shape Memory Polymer NGP3510, Potting Type |
| Shape Memory Polymer NGP2510, Potting Type |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Mechanical Grade, 4H Area: 100% |
| Indium Arsenide (InAs) Wafers, Size: 2”, Thickness: 500± 25 μm, Orientation: 100, EPI-Ready |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 5×5 cm |
| Platinum (Pt) Sputtering Targets, indium, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, Testing Grade |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125” |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 111, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 100, Single Side Polished, Testing Grade |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready, Dopant: Iron (N Type) |
| Silicon on Insulator (SOI) Wafers, Size: 4”, Thickness: 725 μm, P type (Boron doped) |
| Indium Phosphide (InP) Wafers, Size: 3”, Thickness: 600± 25 μm, Orientation: 111 , Single Side Polished, EPI-Ready, Dopant: Iron (N Type) |
| Electric Coin Cell Hydraulic Crimping Machine |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 3”, Thickness: 350 μm, Research Grade, 4H Area: 95% |
| Pneumatic Cylindrical Battery Sealing Machine |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125” |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250” |
| Silicon Carbide Wafer (SiC-4H) – 4H, Size: 4”, Thickness: 350 μm, Testing Grade, 4H Area: 95% |
| Ultrasonic Homogenizer |
| High Energy Ball Mill |
| Indium Arsenide (InAs) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 111, Testing Grade |
| Gallium Antimonide (GaSb) Wafers, Size: 3”, Thickness: 625± 25 μm, Orientation: 111, EPI-Ready |
| Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250” |
| Silicon on Insulator (SOI) Wafers, Size: 6”, Device Thickness: 625 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 8”, Device Thickness: 300 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 8”, Device Thickness: 600 nm, P type |
| Silicon on Insulator (SOI) Wafers, Size: 6”, Device Thickness: 340 nm, P type |
| Pneumatic Die Cutting Machine For Battery Electrode Cutting |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250” |
| Gallium Antimonide (GaSb) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 100, EPI-Ready |
| Gallium Antimonide (GaSb) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 111, EPI-Ready |
| Indium Arsenide (InAs) Wafers, Size: 4”, Thickness: 1000± 25 μm, Orientation: 100, EPI-Ready |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250” |
| Polyhydroxylated Fullerene (Fullerenols)/ C60, (-OH) Functionalized, Dry powder |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125” |
| Shape Memory Polymer NGS5520, Solution Type |
| Shape Memory Polymer NGS4520, Solution Type |
| Shape Memory Polymer NGS3520, Solution Type |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 100, Single Side Polished, EPI-Ready |
| Indium Phosphide (InP) Wafers, Size: 4”, Thickness: 625± 25 μm, Orientation: 111, Single Side Polished, EPI-Ready |
| Platinum Foil, Purity 99.95%, Thickness: 0.5mm, 10×10 cm |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125” |
| Platinum Foil, Purity 99.95%, Thickness: 1 mm, 10×10 cm |
| Large-Automatic-Film-Coater-_Doctor-Blade_.webp |
| Large Automatic Film Coater (Doctor Blade) |
| Platinum (Pt) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250” |