Description

Copper (Cu) Micron Powder

PURITY	99.99 %
PARTICLE SIZE	3 µm
CAS	7440-50-8
DENSITY	8.94 g/cm³
BOILING POINT	2595 °C
MELTING POINT	1083 °C
COEFF. OF EXPANSION @ 20ºC	16.42 x 10⁻⁶
MOHS HARDNESS @ 20ºC	3
ELECTRIC CONDUCTANCE	0.593 microhm-1
CRYSTAL STRUCTURE	Cubic, Face Centered
FORM	Flake
APPLICATIONS	Aerospace Alloys Colorants Electronics Inks Paints Pigments

Quantity	25 g, 100 g, 500 g, 1000 g

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